Alloys such as solder have different melting points, which are pivotal for attaining efficient joints in electronics and tasks related to metalworking. The professionals, alongside framers in metal, are required to have prior knowledge of solders’ chemical makeup and how their properties change under different conditions, as it greatly impacts which solder is used. This guide aims to answer the questions posed about the science behind the solder’s melting point and how it affects one’s work, exploring the types of solder one could utilize, as well as providing tips to make informed decisions for their needs. In the end, this article, with all the provided information, will equip the reader with the ability to properly choose solders that meet the desired results in the reader’s projects.
What is the Solder Melting Temperature, and Why is it Important?
The temperature at which a solder begins to melt and can flexibly unite, usually metals, is referred to as the solder melting temperature. This temperature is important because it indicates how the solder will be applied and also affects the reliability and strength of the final joint. Melting points for common solders like tin-lead alloys range from 183°C (361 °F) to a maximum of 190°C (374 °F). On the other hand, lead-free solders usually melt between 217 °C (423 °F) and 227 °C (441 °F). Selecting the right solder for an application with the right explosion-matched temperature to materials and soldering procedures ensures no excessive heat damage is done during the process, which is crucial for the application.
Defining the Melting Point of Solder
Different solder alloys are tailored for specific applications by engineering their compositions to have distinctive melting points. The melting point of traditional solder is set within, or close to, eutectic points, making them easy to use. An example of this is 63/37 Sn-Pb solder, which has a melting point of 183°C (361°F) and is further enhanced for usability because of the sharp transitions between solid and liquid states.
Solders without lead are now the norm because of the increased need for eco-friendly products. These solders have slightly higher melting points due to the presence of tin mixed with other metals such as silver, copper, bismuth, or antimony. Although SAC305 (96.5% tin, 3% silver, and 0.5% copper) is a common lead-free solder, it is one of the low-temperature solder types because its melting range is approximately 217°C (423°F) to 221°C (430°F).
Another important reason for the increase in the melting point of solders is the incorporation of flux within the material. Although flux has a minor effect on the melting point of the alloy, it enhances effective soldering by cleaning surfaces that need to be bonded.
One must grasp composition, alloy ratio, and flux contribution to select the correct solder type. As with any material, the application of solder needs to be precisely configured to the thermal profile of the components and equipment involved to guarantee strong yet non-destructive structural adhesion.
Factors Affecting the Melting Temperature
Several factors affect the melting temperature of a solder alloy, including the constituent metals, phase diagrams, and impurities within the alloy. The alloying elements Sn, Pb, Ag, and Cu also influence the melting point significantly. For example, a eutectic alloy consisting of 63% Sn and 37% Pb has a melting point of approximately 183 °C, which is preferred because of its sharp single-phase peak.
Non-eutectic alloys may exhibit a range of melting points instead of a fixed point, which may complicate thermal profiles during soldering. An example is the Sn-Ag-Cu (SAC) alloy used in lead-free soldering, with a melting range of approximately 217-221 °C. The ratios of these elements within the alloys are crucial in controlling the performance and compatibility of the alloy in processes.
Even the smallest impurities can alter the alloy’s melting point by either broadening the range of temperatures at which the solder melts or introducing fluctuations into the solder’s thermal behavior. Moreover, the environment external to the alloy, such as pressure and the temperature of nearby materials, can change the effective melting temperature during use. Modification of these parameters ensures that the manufacturers can achieve predictable and dependable results for industrial or consumer applications, especially regarding the melting point of solder.
Importance of Solder Melting in Electronics
In the construction and operation of electronic devices, precise control over the melting of solder is pivotal. Solder joints are used in modern electronic devices for joining the components both mechanically and electrically, hence, solders must work reliably and endure over time. Recent changes indicate that nowadays, lead-free solders are used more and more because of environmental policies like ROHS (Restriction Of Hazardous Substances). These solders contain a melting range (between 217° C and 221° C) that is dependent on the solder’s composition. They aim to perform comparably to traditional solders, with less Sn-Pb solder, while avoiding lead-based solders more than other solder types.
Processes of soldering are efficient when minimal thermal stress is applied to the delicate components of the electronic devices during production. Voids, bridging, incomplete wetting, and overheating are only a few of the many defects that can occur while soldering. Unmanned Aerial Vehicles (UAVs) are a modern invention that rely largely on low-temperature soldering. The solders that are considered are made of alloys such as bismuth and tin. Melting occurs at around 138° C; thus, extreme heat cannot be withstood. Because solder joints are so small, wearable technology and flexible electronics are also considered delicate.
Additionally, solder melting has application in microelectronics and advanced packaging where specific interconnects at the micro and nanoscale impact the reliability of the device. Manufacturers strive to improve performance and longevity with modern technologies by using materials like nano-solders and studying their melting characteristics.
How to Consider When Choosing Solder for Your Project?
Understanding Different Solder Types
Soldering is done using two types of solder in electronic applications: leaded and unleaded. The latter is classified due to the notable concern in human health and environmental standards. Lead-based solders, for instance, one that is 60% tin and 40% lead, are very reliable because of their melting point. On the other hand, unleaded solder is made of tin mixed with small amounts of other metals, such as copper, silver, or zinc, making it a better alternative. Any solder type decision should take into account the operating temperature, durability, and compliance to standards like RoHS (Restriction of Hazardous Substances).
Choosing Between Lead-Free Solder and Lead-Based Solder
Heated solder should have solder preform cutouts utilized effectively in accomplishing physical requirements such as thermal profile and melt temperature capturing, taking into account contemporary practices.
Soft soldering joins of Sn-Pb solder and its alloys undergo liquid phase soft soldering within the temperature region of 183C, while lead-free solder, being more of a composite, can reach a melting point of above 217C due to the composition of alloys in use. The increased energy necessary for thermal leaded solder will only add stress on components, hence, a change in tools to mitigate damage during fabrication.
Mechanical strength and dependability
Soft solder composite with lead results in stronger bond joints. Thus, it does pose an advantage in new mechanically vibrating aviation vehicles. However, lead-free solder joints do tend to become brittle at lower temperatures, which poses issues for components meant to endure harsh conditions, such as automotive or aerospace systems.
The Environment and Sustainability
As an example, the European Union has instituted a RoHS directive that has led to the use of environmentally friendly solders, free of lead, in order to mitigate the risks associated with lead to the health and the environment. Lead-free solders are commonly used in products aimed at global markets or in goods that cater to eco-sensitive consumers. Permission may be granted to continue using leaded solder on historical systems and exempted applications, but consideration of compliance issues is necessary.
Availability and Cost
The availability of lead-free solders, especially those with silver and other expensive constituents, is reported to be lower. Such solders are expensive compared to their leaded counterparts, which may affect the cost of the product during mass production. Furthermore, the company’s soldering tools may require some form of change to lower the operating plating temperature, which may negatively impact the overall costs. However, the advancements in lead-free soldering technologies have been making strides to cutting down the difference in prices.
Lifespan and Long Term Performance of Solder used in different applications can have a major effect on dependability
Some of the solders are said to have outstanding performance over prolonged periods, which are said to be under certain ranges of temperature and humidity, and therefore, lead-based solders are considered to be better for certain high-reliability systems. But due to changes in the building of the solders and their respective components, the lead-free options are beginning to match the performance of the lead-free solders.
In the end, the decision is still dependent on thoroughly examining application requirements, cost factors, production limitations, and even legal requirements for both types of solder. By considering these factors, engineers and manufacturers can achieve optimal solder performance while remaining compliant with current environmental and health regulations.
Selecting the Right Solder Based on Melting Temperature
When considering the effectiveness and dependability of a process, selecting an appropriate solder according to its melting temperature is crucial. It affects the thermal profiles of soldering and the functioning of electronic assemblies afterwards. Sn63Pb37 solder contains lead and has a eutectic melting point of 183°C, which is considered dependable because of its narrow liquidus range. On the other hand, lead-free solders such as SAC305 (tin 96.5%, silver 3%, copper 0.5%) have a higher melting range of about 217°C – 221°C. These higher temperatures require changes to be made for reflow oven settings and material compatibility.
Automotive and aerospace electronics are high-temperature applications that utilize specialized solder alloys with even higher melting points, like Sn10Pb88Ag2, which can go up to 290°C. Low-temperature solder alloys like Sn42Bi58 containing Bismuth have melting points around 138°C. Although these are good for heat-sensitive components, they may face increased brittleness compared to traditional solder alloys. The right type of solder must also take into account thermal fatigue resistance, reliability of the solder joint, and compatibility with both the substrate and components. For instance, higher silver content in lead-free alloys like SAC alloys increases strength but is expensive. Economic feasibility versus performance remains a key dividing factor when assessing solder options. Knowing these parameters allows the manufacturers to custom-design the soldering process according to the requirements of the specific application.
What are the Differences Between Low-Temperature and High-Temperature Solder?
Characteristics of Low Temperature Solder
Low-temperature solders are alloys with a melting point between 138°C and 200°C, depending on their composition. These solders are used in applications that involve temperature-sensitive components or materials that could be damaged or warped at higher temperatures. One of the most well-known low-temperature solder alloys is bismuth-tin (BiSn), which melts at roughly 138˚C.
Benefits of Low-Temperature Solder:
Reduced Thermal Stress: The solders protect more delicate parts like LEDs, plastic substrates, and flexible printed circuit boards (FPCBs) from thermal exposure because of their low melting point.
Energy Efficiency: Soldering at lower temperatures saves energy, making it a green solution.
Performance Considerations and Limitations
Mechanical Strength: The alternative solders have lower mechanical properties, such as tensile strength, when compared to higher temperature options. BiSn alloys, for instance, have a lower melting point but tend to have a lower ductility and more brittleness under stress or thermal cycling.
Cost: Bismuth, along with other elements of low-temperature alloys, can be costly, which increases the price of the material.
Uses
Consumer Electronics: Smartphones, tablets, and wearables incorporate micro-components in their manufacturing, which require low-temperature soldering to ensure that those components are not damaged during assembly.
Automotive Electronics: In some of the more advanced ADAS features like interior control systems, low-temperature solder is used to ensure reliability in the miniaturized circuits employed.
LED Manufacturing: In this industry, diodes and substrates of LEDs are sensitive to heat during the soldering stage, which makes low-temperature soldering solutions the ideal approach. Recent studies have pointed out that the optimization of alloy compositions to include small amounts of silver (Ag) or nickel (Ni) can improve the reliability of solder joints without drastically increasing the melting point. These developments assist in overcoming some of the mechanical shortcomings of low-temperature solder materials.
Benefits of Using High-Temperature Solder
The benefits of high-temperature solder are extensively useful in various demanding applications. It guarantees excellent thermal stability, which is useful in high-temperature operational settings. Moreover, it provides excellent mechanical strength, which enables solder joints to endure tough conditions while maintaining reliability. In industries such as aerospace and automotive, where reliability is crucial, solder joints must withstand harsh conditions. Finally, high solder increases resistance to cyclic heating, which reduces the likelihood of fatigue failure over time.
Applications of High or Low Temperature Solder
The choice of a high or low-temperature solder depends on the needs of particular applications, including their thermal profile, mechanical stress, and reliability requirements. The key applications of both high and low-temperature solders are defined below:
Aerospace Industry
- High-Temperature Solder: Used in high-technology peripherals like avionics and engines, which can exceed 200°C. The solder maintains reliability over time, preventing joint failure associated with severe thermal cycling.
- Low-Temperature Solder: Applied with less critical electronics, like cabin control systems, because the heat-sensitive parts require lower processing temperatures.
Automotive Industry
- High-Temperature Solder: This is Common in the engine control unit (ECU), sensors, and powertrain electronics that undergo significant thermal loading. Research indicates that solder joints within this domain are anticipated to function between 250°C for thermal endurance value.
- Low-Temperature Solder: Used in infotainment and interior lighting systems where thermal requirements are less stringent, but cost and manufacturability become important factors.
Consumer Electronics
- High-Temperature Solder: Used in smart watches and smartphones, which may experience higher ambient temperatures during use. Their melting point is advantageous in preventing joint inconsistency resulting from overheating of the device.
- Low-Temperature Solder: Memory modules and connectors are some examples of the more sensitive components that make use of this type of solder due to its low risk of thermal stress damage and compatibility with heat-sensitive substrates.
Medical Devices
- High-Temperature Solder: Used in surgical tools and implantable devices which are repeatedly autoclaved above 130°C for sterilization. This type of solder is the most appropriate because of its strong resistance to extreme heat.
- Low-Temperature Solder: Used in diagnostic equipment and portable devices that require low temperatures to prevent damage to components during assembly.
Telecommunications and Networking
- High-Temperature Solder: Used in outdoor equipment such as satellite communication systems and base stations that face harsh weather and need exceptional thermal cycling resistance.
- Low-Temperature Solder: Used in delicate modules like optical fibers to limit thermally induced damage during the assembly process.
Power Electronics
- High-Temperature Solder: Used in inverters, converters, and high-current modules that generate a lot of heat while operating. Their reliability with solder joints greatly reduces the failure rate of these systems over time.
- Low-Temperature Solder: This is Common in more delicate units, like power management systems that have low thermal budgets during fabrication.
The usage of high or low-temperature solder is influenced by a variety of factors, such as product requirements, production workflows, materials involved, and the solder’s intended lifespan. Contemplating these factors ensures the appropriate development of systems and their reliability across different industries.
How Does Solder Alloy Composition Affect Solder Melting?
Role of Tin and Other Metals in Solder Alloys
Most solder alloys have tin as an essential component owing to its low melting point, good wetting ability, and consistent bonding capability. Solder’s mechanical strength, thermal conductivity, and oxidation resistance are improved due to the alloying of metals like lead, silver, and copper with tin. For instance, silver enhances the tensile strength and thermal fatigue resistance of the solder, while copper improves the durability of the solder joint. Each alloy contributes different effects, and their ratios are altered to achieve the required mechanical strength and environmental stability for varying applications.
Impact of Solder Alloy on Melting Point
The composition of a solder alloy determines its melting point. For example, tin-lead solder alloys have a eutectic phase at 63% tin and 37% lead, which yields a melting temperature of 183°C, ensuring a clear solid-liquid transition. On the other hand, lead-free solders like SAC alloyed tin-silver-copper alloys tend to have higher melting points, approximately 217–220°C, depending on the alloy’s configuration. Efforts are made to modify the alloying constituents to improve the melting range and reliability of performance for certain applications.
Choosing the Right Solder Alloy for Specific Applications
Choosing the correct solder alloy for a certain use requires multiple parameters to guarantee performance and dependability. Important factors include operating temperatures, mechanical strength, resistance to thermal fatigue, and compliance with environmental mandates like RoHS regulations.
Operating Temperature
The temperature at which a particular application is performed determines the specific thermal performance needs of the solder. Bismuth-free alloys, SAC305 for example, are popular in the realm of electronics due to their melting points, usually between 217-220 °C, which is adequate for contemporary circuit boards. For high-temperature systems, bismuth alloys or other elements with high melting points may be essential.
Mechanical Strength and Joint Reliability
Stronger grade solders prove helpful for the mechanical joints of aerospace and automotive electronics systems; silver or copper-added solders like SAC305 tend to augment joint strength. Its amazing mechanical properties have led to SAC305 being the most recognized solder alloy; modern alloys like SAC387 and SAC405 provide complementing resistance to thermal cycling stresses.
Resistance to Thermal Fatigue
Devices that experience extreme changes in temperature are at a risk of solder joint fatigue because of cyclical soldering. Heat-induced fatigue becomes less pronounced with the addition of small amounts of Subsidy dopants. For instance, SAC-X Plus® alloys are created to be heat resistant.
Compliance with Environmental Norms
To align with his regulations, lead-free solder alloys like SAC and bismuth-containing ones are used. These more expensive alloys are preferred because they are compliant with eco-friendly policies. Because of rules in various jurisdictions, the use of solder-free solders is on the rise.
Certain Applications
Increasingly looked at for use in certain applications, like in medical devices or high-power LEDs, are solders made of indium because of their superior thermal conductivity and low melting points. In precision tasks like semiconductor packaging, other son gold to halvex dual solders are useful too, where the temperature threshold is close to 280 degrees Celsius.
Data Supporting Solder Alloy Selection
New solder formulations are appearing, which include hybrid SAC alloys containing specialty additives. SAut2002 shows that joints of SAC305 solder can endure more than 3,000 temperature cycles between -40°C and 125°C. This is appropriate for industrial and automotive applications. On the other hand, SnBi solders are also appropriate for soldering assemblies that are delicate to heat, though they have less fatigue resistance due to their melting temperature of about 138°C. The constant evolution in the area guarantees an extensive assortment of solder alloys designed to fulfill the precise requirements of industries.
What are the Best Practices for Achieving Strong Solder Joints?
Using the Correct Soldering Temperaturea
Using a proper soldering temperature ensures the soldered joint is strong and prevents component as well as substrate damage. The ideal temperature varies based on the alloy of the solder being used. Most solders of SAC305 type require reflow temperatures between 235°C and 250°C for the melting and wetting processes to occur. With flux-enabled systems, going over these temperatures can degrade flux efficiency and damage heat-vulnerable components.
When discussing low-temperature alloys such as SnBi, peak reflow temperatures around 170°C work best with assemblies for temperature-sensitive components. Anything lower may cause poor joints due to lack of wetting. Research supports the idea that controlling mechanical stress from the heating rate, cooling rate, and soldering processes improves solder joint reliability in the long term.
Being able to preheat and reach the peak soldering temperature has to be done by sipping within the suggested ranges, which takes thermal profiling to great accuracy and can help with all stages of soldering. Coupled with more advanced techniques like multilayer PCBs, it aids in the preservation of inter-layer folding to reduce dissociation between temperature across layers. Integrating auxiliary data that caters to optimal soldering temperatures and those current industry guidelines makes for a strong, stable bond in the connection.
Ensuring a Proper Soldering Process
To attain precision soldering, several key elements require close monitoring. The first one is choosing the flux correctly. The amount of work that has to be done in the cleaning process after soldering is aided by fluxes that are described as no-clean. Focused care is needed because it can be very difficult to ensure material compatibility with components on the board because of certain materials used and the designs etched on the board.
Another crucial consideration is the solder paste itself. Inaccurate handling and storage of solder paste can lead to voiding as well as inconsistencies concerning the printing and the stencil, which translates to poor electrical and mechanical functioning. Paste getting to room temperature from controlled temperatures of between 0°C and 10°C, significantly decreasing the chance of condensation, is recommended.
Controlled heating is essential when reliable solder joints are a concern. Studies indicate that ramp rates that are controlled at pre-heating stages, specifically between 1°C and 3°C per second, help reduce thermal shock to components in addition to ensuring that temperature circulation is consistent. Moreover, the use of the reflow oven in a nitrogen environment has been proven to enhance oxidation problems as well as overall joint strength and solderability.
Data from void-free soldering optimization for cavities within thermal pads and power components at industry benchmarks is critical. Although voids are usually accepted within standards up to a threshold of 25%, advanced X-ray inspection systems are being urged for use in high-reliability applications for scrutiny under more rigid standards.
Through the use of thermal profiling equipment, real-time monitoring of the soldering parameters applied at various steps in the working process across batches can be done, enabling the setting of best practices. With these measures guaranteed, remarkable deviations are possible, greatly improving response times to altering materials or climate conditions. Incorporating strict quality control systems optimally positions the manufacturer to meet the demanding quality targets set at the assembly level while increasing the overall performance of the electronic assemblies.
Maintaining Solder Joint Integrity
To achieve high integrity of a solder joint, several elements that impact performance, reliability, and lifetime in an electronic assembly need to be managed. The choice of materials for solder paste is one of the most important things to consider. It has been shown that the use of low-voiding solder pastes with specially designed flux chemistries suppresses significant HIP, inadequate wetting, and voiding defects. Such formulations are extremely advantageous in high-density designs where thermal and mechanical strain is enormous.
Moreover, new developments in components and PCB finishing surfaces have depicted that gold-plating PCBs with OSP or ENIG solder interfaces greatly impact the reliability of a solder joint. For instance, ENIG offers high corrosion resistance and thus is widely accepted in gold solder non-soldered pad application areas that require high reliability, but it suffers from “black pad” defects during over-etching processes.
For other, more general factors, the effect of thermal cycling is crucial to a solder joint’s reliability, mainly joints with lead-free solders like SAC305. Some studies claim that SAC305 joints have greater thermally induced micro-cracking phenomena due to a higher modulus and reduced ductility compared to traditional leaded counterparts. The use of underfills, corner bonding techniques, and other such methods can relieve some of these stresses and improve strength, especially in wave soldering processes.
Lastly, regular monitoring and evaluation of solder joints are crucial. Automated Optical Inspection systems help identify surface faults, while X-Ray Inspection is vital for assessing concealed voids and assessing the internal structural features of a solder joint. Defect detection reliability critical for automotive, aerospace, and medical device assemblies predominately relies on the accuracy of the inspection equipment’s sophisticated algorithms, which now provide greater accuracy for detecting defects. When aligned with thermal profiling units, other process monitoring devices, and strong process controls, such systems with their multi-dimensional approach to measuring yield monitor rework expense associated with process control technologies become increasingly cost-effective for modern electronics manufacturing.
Integrated by refined processing techniques, enhanced materials, and advanced inspection, the solder joint integrity challenges posed by complex dynamic production environments are dealt with more efficiently.
Frequently Asked Questions (FAQs)
Q: What is the solder melting point of tin-lead solder, and what is the lead-free solder melting point?
A: The melting point of lead-free solder alloys is higher than that of tin-lead solder alloys. For example, tin-lead solder: \({S}n{P}b\) melts at approximately \(183°C\) \((361°F)\), whereas common solder alloys such as SAC305 \((96.5\%{Sn}+3\%{Ag}+0.5\%{Cu})\) have a melting point range of \(217-220°C\)(423-428°F). Changes in the melting/boiling point can create problems with the soldering process and equipment used, which is problematic for joints that require lead-free solder.
Q: Why is eutectic solder important?
A: A solder that exhibits distinct melting points, such as range, is called eutectic solder. A solder that transitions from a melting to a liquid state is said to undergo melting range. Eutectic solder is significant secondary to achieving greater joint reliability and eliminates chances of cold solder joints along with greater control over soldering due to the controlled heat input. The most common variant of eutectic solder is the cadmium 63/37 tin-lead alloy, which has a melting point of \(183°C(361°F)\).
Q: In what ways does the melting range of non-eutectic solder impact its usefulness?
A: Non-eutectic solder consists of a series of temperatures within a specified range as opposed to a defined melting point. It has a range of temperatures referred to as a “melting range,” in which the solder passes through a “pasty” phase. The range may result in requiring higher temperatures, which may lead to potential problems with achieving consistent joints, interfering with the soldering cycle. This is why a careful solder selection with appropriate process adjustments is paramount.
Q: Can you give me some examples of low-temperature solder and suggest situations for them?
A: An example is indium-based solder. Other low-temperature solder types include bismuth-containing alloys. For certain indium alloys, their melting temperatures can drop as low as 58°C (136°F) . When dealing with delicate components or materials that are heat sensitive, low-temperature solders are ideal. They are also useful for step soldering processes where multiple soldering operations are performed on the same assembly without affecting previous joints.
Q: What is the difference between silver solder and electronic solder in terms of melting point?
A: Silver solder or hard solder, which is used in jewelry making or industrial applications, has a much higher melting point than silver solder. The melting point for electronic solder ranges from 180-230°C (356-446°F), whereas silver solder has a melting point of 600-750°C (1112-1382°F). This solder is used in applications requiring stronger joints or higher operational temperatures.
Q: What factors should be considered when selecting solder about its melting point?
A: The following factors must be taken into consideration when choosing a solder: component sensitivity to heat, joint strength, the operating temperature of the engineered product, available equipment and temperature ranges, and any applicable industry standards (in the case of solders with no lead, compliance with RoHS is required). Also, consider whether a eutectic solder with a defined melting point is more applicable than a non-eutectic solder that has a melting range.
Q: How does lowering the melting point of solder wire affect the soldering process?
A: With the use of a solder wire with a lower melting point, the process of soldering is made simpler and arguably safer when it comes to heat-sensitive components. This allows for the use of a low-temperature soldering iron, which minimizes the risk of burning. On the flip side, it may also create weaker bonds compared to the higher melting point alloys. It is critical to remember that the working temperature of the final product should not surpass the melting point of the solder to ensure joint integrity.
Q: What issues does solder with high lead content pose with the solder joint melting point?
A: Solder with high lead content, such as 90/10 or 95/5 lead-tin alloys, has a distinctly higher melting point than standard solder or Sn-Pb solder. The melting point (approximately 300-310°C or 572-590°F) does pose challenges as it necessitates high-temperature soldering equipment, and thermal destruction of components or PCBs may be an issue as well. Further, high lead solder does face restrictions for a majority of these applications because of environmental and health risks, which shifts the focus towards lead-free alternatives in most electronic manufacturing.
Reference Sources
1. Improved Hydrogen Production from Ball-Milled Magnesium-Aluminum Scrap with A Low Melting Point Solder Alloy
- Authors: O. Buryakovskaya et al.
- Published in: Materials
- Publication Date: June 1, 2023
- Summary: This research takes into account the processes of composite materials construction based on magnesium alloys and solders using Sn-Pb eutectic through high energy ball milling. It particularly studies the hydrogen generation characteristics of these composites in sodium chloride solution. Results indicate that the energy ball milling time, as well as the amount of the solder alloy used, has a considerable impact on the microstructure and the materials’ reactivity. Most notably, the range of low melting point solders, especially concerning ball milling time of one hour, demonstrated the highest hydrogen generation, which showcases his/her involvement in solders (Buryakovskaya et al., 2023).
2. Processes of creating conduction paths in solderable epoxy composite with a mix of low/high melting-point solder fillers
- Authors: Min Jeong Ha et al.
- Published In: Journal of Materials Science: Materials in Electronics
- Public Date: 1, Apr 2023
- Summary: The study focuses on the mechanics of conduction path formation in solderable epoxy composites containing a blend of solder fillers with low and high melting points. The emphasis is placed on the interaction of different types of solders and their effect on electrical properties alongside mechanical strength. The data suggests that the careful choice of solder type and filler improves electronic mounting device performance concerning melting point, joints dependability, and overall reliability(Ha et al., 2023, pp. 1–13).
3. The performance and the interfacial reaction mechanism of solder pastes with nano-sized intermetallic compounds and mixed IMCs are analyzed through the lens of their melting point.
- Authors: He Gao et al.
- Published In: Journal of Materials Science: Materials in Electronics
- Date of Publication: April 1, 2023
- Summary: The goal of this investigation is centered around the purpose of this research, which is to study the performance of solders by incorporating intermetallic compound (IMC) nanostuctures that showed variable melting. The study pays attention to the interfacial reactions of the soldering processes and their impact on the melting characteristics and the performance of the solders. The authors of the study argued that the results show the addition of nano IMCs into the solder formulations was found to improve the interface corrosion resistance and the mechanical strength of the solder joints, which helps in optimizing solder alloys(Gao et al., 2023).
